FSP’s Leadership in Power Efficiency, Thermal Design, and Chassis Innovation

[Taipei, May 14^th 2025] – FSP is excited to participate in COMPUTEX TAIPEI 2025, where we will unveil our latest and most powerful lineup of power supplies, PC cases, and cooling solutions. As a leading force in performance hardware and innovative design, FSP invites industry professionals, system builders, and PC enthusiasts alike to experience the future of PC hardware up close.

FSP unveils a complete lineup of ATX 3.1 and PCIe 5.1 power supplies at COMPUTEX 2025

Including both ATX and SFX form factors—fully compliant with Intel’s latest PSU Design Guide.

Following the debut of the flagship MEGA TI series, FSP expands its range with new MEGA PM (Platinum efficiency) and MEGA GM (Gold efficiency) series,giving performance-focused users more choices in wattage and efficiency whil emaintaining ultra-low noise operation. The popular VITA GM series also sees amajor upgrade with the launch of VITA PM, now certified for 80 PLUS Platinum, delivering the perfect balance of cost and energy savings for mainstream users.

In a bold step forward, FSP is debuting the 1200W Platinum-certified SFX-L PSU for the first time at COMPUTEX 2025—alongside the 1000W SFX Platinum model, showcasing FSP’s leadership in compact high-power solutions.

FSP unveils new SFF-READY ITX Case S550 at COMPUTEX

Making a bold statement at COMPUTEX, FSP introduces the all-new S550 ITX case, certified under NVIDIA SFF-READY program and fully compatible with the powerful RTX 5090 Founders Edition graphics card. Designed for elite users who crave top-tier performance in a compact form, the S550 redefines what small form factor cases can offer — combining stunning aesthetics, optimal airflow, and high-end GPU support to deliver a true dream chassis.

FSP Cooling Solutions Evolve — New MP9 Series Dual-Tower Flagship Delivers Ultimate Performance and Craftsmanship

Building upon the success of the acclaimed MP7 series, FSP is proud to unveil its next-generation flagship cooler — the MP9 Series. Featuring a dual-tower design and two 140mm high-performance silent fans, the MP9 integrates six 6mm high-efficiency copper heat pipes with a precision-welded copper base for rapid heat transfer and superior CPU cooling. Equipped with durable FDB bearing fans and a tool-free magnetic top cover design, allowing for quick and easy installation without removing the fans. The sleek all-black aesthetic, along with a detachable top cover, offers a balance of elegance and functionality — a perfect expression of engineering meets design.

Join us and explore what’s next in performance computing — innovation, efficiency, and design all in one place!

Booth Location: I0001, 1st Floor, Hall 1, Nangang Exhibition Center
Dates: May 20^th– May 23^rd, 2025