Three heatpipes provide a perfectly flat surface which ensure faster heat dissipation, the CPU Direct Contact technology also protecting CPU and extending its lifespan.
Windale 3 with height of 142mm, is a compact tower cooler, designed to fit in tight builds or small form factor system.
The appearing heatsink with totally 42 heatfins of Windale 3 offers reduced windage and leads to even better cooling performance.
A 92mm fan fits to enhance the airflow produces impressive cooling performance and low noise with an optimized 7 Paragliding blade design.
AMD FM2+, FM2, FM1, AM2, AM2+, AM3, AM3+, AM4
INTEL LGA 775, 1150, 1155, 1156, 1366, 2011, 2066
The mounting of Windale 3 is much easier, requiring less work steps and improving user friendliness at installation of the fan.
|CPU Supported Platforms||Intel® LGA2066 / LGA 2011-3 / 2011 / 1366 / 1156 / 1155 / 1151 / 1150 / 775 / 1200 socket
AMD® AM4 / AM3+ / AM3 / AM2+ / FM2+ / FM2 / FM1 socket
|Dimensions (LxWxH)||98 x 82 x 142mm|
|HeatSink Dimensions (LxWxH)||98 X 56 x 142 mm|
|Heatsink Material||Aluminum Alloy|
|Heat-pipe||6mm x 3PCS|
|Fan Speed||600-2200 RPM (PWM) ± 15%|
|Bearing Type||Sleeve Bearing|
|Fan Air Flow||42.2 CFM ± 10%|
|Noise Level||26±3 dBA|
|Rated Voltage||12 VDC|